Copper material for high-purity copper sputtering target, and high-purity copper sputtering target

Abstract

This copper material for a high-purity copper sputtering target is such that the purity of Cu excluding O, H, N, and C is in a range of 99.999980 to 99.999998 mass%, the Al content is 0.005 mass ppm or less, and the Si content is 0.05 mass ppm or less.